This product is an 8-layer high-precision rigid-flex hybrid circuit board. It achieves superior mechanical and electronic performance through the combination of 6-layer rigid PCB and 2-layer flexible PCB. Using MITSUBISHI laser drilling equipment, it can accurately complete L1-L3, L6-L8 two-step laser hole processing, and implement blind buried via technology (VIA in pad process) to support advanced interconnection technology (HDI). The final treatment method of the board is ENIG (chemical gold plating), and the structure uses a blue solder mask layer and a yellow covering film. In product design, impedance control requirements are taken into consideration, and the stacking structure is designed based on a special layer sequence to ensure signal integrity. In addition, BGA resin hole filling processing is used to support small-pitch BGA packaging to ensure accurate and stable electrical performance. This product complies with environmental protection requirements such as RoHS and REACH, and is suitable for high-end electronic markets such as communications, medical, industrial automation and other fields.
- Eight-layer structure, integrated with six layers of rigid PCB and two layers of flexible PCB, provides excellent mechanical strength and electrical performance. - Advanced laser drilling technology and blind buried via (VIA in pad) process to support high-density interconnect (HDI) applications. - ENIG surface treatment ensures superior welding performance and long-term reliability. - Adjust impedance control to ensure signal integrity, suitable for high-frequency transmission environments. - BGA resin hole filling technology enables small-pitch BGA packaging and improves electronic assembly density and stability. - Comply with RoHS and REACH environmental standards and respond to the trend of green electronics manufacturing.
- High-end communication equipment, such as base stations, routers, and switches, realize efficient transmission of complex signals. - Critical circuit board applications in medical instruments, ensuring device accuracy and stable electronic performance. -In the field of industrial automation, electronic control systems and sensor interfaces adapted to harsh environments. - Consumer electronics that require high-density packaging and complex circuit design, such as smartphones and wearable devices. - New energy and automotive electronics, providing powerful and reliable circuit solutions to meet stringent performance requirements.
